This week’s technology news from Amicus ITS – Friday 30th August 2013

Does the size of your Cloud provider protect you more?
Amazon Webs Services was recently hit by a surge in demand causing servers to big name websites including Instagram, Vine and Netflix to go down or only provide intermittent service for several hours. Whilst the most notorious providers are Rackspace, Google, Windows Azure and Amazon, the US 2012 rankings endorse lesser known names such as Connectria, Layered Tech and Qube aggregated on average response time, availability and consistency. Being smaller and less famous should not impede your selection of the right Cloud provider and consistency and the support of virtual machines and their web applications are the new strategic goals of enterprise.

Note to IT vendors – changing the CIO to CPO
IT Directors or Chief Information Officers are seen as the intelligence disseminating arm for technology in business organisations. But the “I” might soon be changing to a “P” for Policy and Process. As business security and monitoring has to keep up with the adoption of emerging technologies, minimizing disruption whilst enabling the workforce to perform, should result in good collaboration with stakeholders and respect for standards if “P” also stands for best Practice.

Microsoft’s Steve Ballmer to retire
Microsoft has announced that CEO Steve Ballmer will be retiring within the next 12 months, having just six weeks ago announced his ‘risky re-organisation’ of the entire company. “There is never a perfect time for this type of transition, but now is the right time” Ballmer said. John Thompson who is director of the board will lead a committee to find the new CEO. As Microsoft makes the tricky move to a devices and services company, finding the right person to lead is more important than ever.

MIT develops 110 core processor
The Massachusetts Institute of Technology has revealed the development of a 110 core processor. Called the Execution Migraine Machine, the project was aimed around reducing traffic inside chips, for faster processing and greater power efficiency. Most manufacturers have moved away from adding extra cores. With the core count from top end machines ranging from 8-16, it is quite a feat by MIT researchers to squeeze 110 in to the 10mm x 10mm chip. This is not a chip which will be available in store to buy, but the techniques used for power efficiency could find their way into mobile devices of the future.